LIGENTEC is a business-to-business (B2B) company that produces Photonic Integrated Circuits (PIC) for customers in advanced technology sectors like ground and space communication, Quantum technologies, LiDAR, and Biosensors. LIGENTEC specializes in the commercialization of the all-nitride-core technology. LIGENTEC empowers customers to develop their products in the era of industrial revolution 4.0 by offering low-loss PICs with active components.
Strategically headquartered in close proximity to the prestigious Swiss Federal Institute of Technology (EPFL) in Lausanne, Switzerland, LIGENTEC is a European company with offices near X-Fab in Corbeil-Essonnes, France. Our global presence allows our cutting-edge chips to be used in applications worldwide. Through collaboration with a major European volume partner, we are well-prepared to supply large-scale markets while ensuring efficient and effective delivery of our innovative solutions.
PIC DESIGN
ADVANCED MODULES
X2. Multi level photonics circuits
LoCA. Local cladding open for sensing and bonding
P1+. High efficiency heater module for thermo-optic tuning
ExSpot. Spot size converters for mode matching to SMF in 1550nm
RIB. Enabling low loss grating coupler and polarisation management
Integration of actives components
Low loss delay line
Mach-Zehnder Interferometer
Phase shifter
Tunable Mach-Zehnder
Tunable ring resonator
Polarisation management
Splitter
PIC DESIGN
ADVANCED MODULES
X2. Multi level photonics circuits
LoCA. Local cladding open for sensing and bonding
M1. High efficiency heater module for thermo-optic tuning
ExSpot. Spot size converters for mode matching to SMF in 1550nm
RIB. Enabling low loss grating coupler and polarisation management
Integration of active components
Low loss delay line
Mach-Zehnder Interferometer
Phase shifter
Tunable Mach-Zehnder
Tunable ring resonator
Polarisation management
Splitter
MARKET APPLICATIONS
WHY PHOTONIC INTEGRATION?
MARKET APPLICATIONS
WHY PHOTONIC INTEGRATION?
