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Break Through the Limits of AI Scale‑Up

Power, Performance, and Scalability for Rapid Inference

AI inference is today’s architecture bottleneck. As model complexity and demand grow, scale-up infrastructure must deliver the throughput and efficiency large-scale inference workloads require.

Co-packaged optics (CPO) overcomes the limitations of traditional copper and pluggable optics by enabling thousands of GPUs to operate as a single unified system with the bandwidth and latency needed for hyperscale AI infrastructure.

What Changes with Optical Scale-Up

Transform AI Economics
Unlock up to 20x improvement for future large-scale AI models, delivering improved tokens per dollar and tokens per watt.
Built for Hyperscale Reliability
Fewer components and a more reliable platform designed for large-scale AI deployments.
Unified GPU Fabric
Enables thousands of GPUs to operate as a single, unified compute system across multiple racks or even entire data center domains.
Break the Power Wall
Distributed across multiple industry-standard racks, maintaining thermal density and delivering greater 3-5× power efficiency.
Open, Flexible Architecture
Protocol-agnostic optical chiplets integrate into existing ASIC and packaging flows without vendor lock-in.
Profitability

20×

improvement for next-generation AI models

Scalability

5–10×

higher bandwidth to handle exponential data growth

Performance

10×

lower latency for real-time AI applications

Efficiency

3–5×

greater power efficiency to break through the power wall

Ayar Labs’ CPO Solution

AI performance and profitability with a CPO solution that enables thousands of GPUs to operate as a single unified system with the bandwidth and latency needed for hyperscale AI infrastructure.

Proven Technology, Lower Risk

Ayar Labs delivers the most performant, compatible, and manufacturing-ready CPO solution for AI scale-up. The TeraPHY™ optical engine and SuperNova™ external light source create optical fabrics that connect thousands of GPUs across racks for hyperscale AI infrastructure.

Protocol-agnostic, open-architecture optical chiplets integrate seamlessly into ASIC, packaging and manufacturing flows, shortening time-to-market while eliminating vendor lock-in.

Discover Our CPO Solution
Explore Performance Benefits by the Numbers

Connect with one of our experts to see how optical connectivity transforms throughput, interactivity, and total cost of ownership (TCO). Our AI System Architecture Tool demonstrates how incorporating CPO in AI platforms improves the performance and economics of AI inference models.

Contact Us For a Live Demo
“AI cluster scale-up networks are bounded by copper connectivity distances. Network power efficiency is limited by power density and cooling. The challenge is copper doesn’t have the I/O connectivity to put everything together. CPO will break these boundaries.”
Erez Shaizaf
Former CTO of Alchip
“Silicon photonics is reshaping how AI infrastructure is built. With Ayar Labs’ leadership in co packaged optics and Wiwynn’s strengths in rack level integration and manufacturing, we accelerate the shift from silicon ready innovation to system ready solutions."
William Lin
President and CEO of Wiwynn
"Our new joint design allows us to address the challenges of CPO integration—architectural, power and signal integrity, mechanical and thermal—ensuring our future customers have access to a robust, high-bandwidth and power-efficient solution.”
Igor Elkanovich
CTO of GUC
AI Infra 2025 Presentation
Alchip, Astera Labs, and Ayar Labs Discuss the Realities of Commercial CPO Deployment
Improving the Scale-Up Performance of AI Clusters with Optical I/O
Let’s Get Serious: TeraPHY™ Optical Engine Passes the Test for AI Scale-Up at Volume

Ready to Scale?

Ayar Labs is delivering the first CPO solution backed by AI industry leaders and built with leading ASIC, ODM, foundry, and packaging partners across Taiwan to support high-volume manufacturing.

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