Working Silicon. Proven Impact.

Live Presentations and Tasty Snacks at BOOTH #2418
Join Us for Chips & Chat
Learn about co-packaged optics—specifically optical I/O—for AI scale-up infrastructure and the huge impact optical I/O delivers in terms of tokens per second, power savings, and other key profitability metrics.
Transforming AI Scale-Up Architectures with Co‑Packaged Optics
This Chips & Chat session will cover solutions to current I/O bottlenecks and rising compute rack density. Learn how Ayar Labs optical I/O enables scale-up growth for generative AI in advanced multi-chip packages without increasing rack power.

Quantifying Optical I/O’s Impact on AI System Scaling
In this Chips & Chat session, we’ll use the updated AI System Architecture Tool to look at AI inference metrics that matter as well as the benefits of Ayar Labs’ optical I/O in AI scale-up and optically connected extended memory.

Validation of UCIe-Based Optical Chiplets for AI Scale-Up
Learn about the necessity of UCIe-based co-packaged optical chiplets for next-generation AI inference infrastructure. We will demonstrate the industry’s first optical chiplet optimized for AI scale-up, with validation data on high-bandwidth, low-latency, microring resonator-based DWDM links.

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The Co-Packaged Optics Ecosystem
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Expert Perspectives on the Future of Connectivity

The battle for AI supremacy will be won in the infrastructure layer. Experts from Ayar Labs, Astera Labs, and Alchip discuss how silicon photonics and co-packaged optics (CPO) will define the next era of AI performance and efficiency.

The battle for AI supremacy will be won in the infrastructure layer. Experts from Ayar Labs, Astera Labs, and Alchip discuss how silicon photonics and co-packaged optics (CPO) will define the next era of AI performance and efficiency.
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Contact us at [email protected] to learn more.





