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Visit Ayar Labs at SC25

NOVEMBER 16–21, 2025 IN ST. LOUIS, MO | BOOTH #2418

See How Co-Packaged Optics Changes the Future of AI Infrastructure at Supercomputing 2025
AI Infra Summit

Working Silicon. Proven Impact.

Experience how Ayar Labs optical I/O delivers AI scale-up and profitability with live demos of our latest solution and our AI System Architecture Tool.
Live Presentations and Tasty Snacks at BOOTH #2418

Join Us for Chips & Chat

Learn about co-packaged optics—specifically optical I/O—for AI scale-up infrastructure and the huge impact optical I/O delivers in terms of tokens per second, power savings, and other key profitability metrics.

Transforming AI Scale-Up Architectures with Co‑Packaged Optics

This Chips & Chat session will cover solutions to current I/O bottlenecks and rising compute rack density. Learn how Ayar Labs optical I/O enables scale-up growth for generative AI in advanced multi-chip packages without increasing rack power.

Wil Tumamao
Ayar Labs
Strategic Business Development, Ecosystem & Partnerships
NOV
18
11:30–11:50 AM
NOV
19
11:30–11:50 AM

Quantifying Optical I/O’s Impact on AI System Scaling

In this Chips & Chat session, we’ll use the updated AI System Architecture Tool to look at AI inference metrics that matter as well as the benefits of Ayar Labs’ optical I/O in AI scale-up and optically connected extended memory.

Marjan Fariborz
Ayar Labs
Senior Staff Engineer, System Architecture
NOV
18
3:30–3:50 PM
NOV
20
11:30-11:50 AM

Validation of UCIe-Based Optical Chiplets for AI Scale-Up

Learn about the necessity of UCIe-based co-packaged optical chiplets for next-generation AI inference infrastructure. We will demonstrate the industry’s first optical chiplet optimized for AI scale-up, with validation data on high-bandwidth, low-latency, microring resonator-based DWDM links.

Vishal Chandrasekar
Ayar Labs
Director, Product Management
NOV
19
3:30-3:50 PM

Raffle Drawings

NOV
18
3:50–4:00 PM
NOV
19
3:50–4:00 PM
NOV
20
11:50–12:00 PM

The Co-Packaged Optics Ecosystem

Partnered with Industry Leaders

AMD
NVIDIA
TSMC
GlobalFoundries
Intel
Macom
GlobalFoundries
Intel
Macom

Key Industry Standards

CW-WDM MSA
UCIe

Expert Perspectives on the Future of Connectivity

The battle for AI supremacy will be won in the infrastructure layer. Experts from Ayar Labs, Astera Labs, and Alchip discuss how silicon photonics and co-packaged optics (CPO) will define the next era of AI performance and efficiency.

The battle for AI supremacy will be won in the infrastructure layer. Experts from Ayar Labs, Astera Labs, and Alchip discuss how silicon photonics and co-packaged optics (CPO) will define the next era of AI performance and efficiency.

Blog

Building the Future of AI Infrastructure: The Power of a Robust ASIC Ecosystem

AI Solutions

AI Scale-Up Architecture with Optical I/O

Blog

Co-Packaged Optics Step into the Spotlight
NOVEMBER 16–21, 2025 | BOOTH 2418

See you there!

Join us in St. Louis, Missouri to test drive our AI System Architecture Tool and see a live demo of our newest technology. We’ll also share expert presentations and key insights on optical I/O for AI infrastructure.

Contact us at [email protected] to learn more.