Ranovus, Your Co-Packaged Optics Partner of Choice for Wafer and Chips Scale XPU – CPO
Cerebras Systems and Ranovus set to revolutionize AI Compute Platform with Wafer Scale XPU-CPO
Andrew Feldman (left), co-founder and CEO of Cerebras & Hamid Arabzadeh (right), CEO and founder of Ranovus.DARPA...
Ranovus® announces collaboration with Jabil® for mass production of ODIN® optical engine
Ranovus® announces collaboration with Jabil® for mass production of ODIN® optical engine
Ranovus, Your Co-Packaged Optics Partner of Choice for Wafer and Chips Scale XPU – CPO
Lighting up the future of AI™
Cerebras Systems and Ranovus set to revolutionize AI Compute Platform with Wafer Scale XPU-CPO
Andrew Feldman (left), co-founder and CEO of Cerebras & Hamid Arabzadeh (right), CEO and founder of Ranovus.DARPA...
ODIN® Single-chip
Optical Engine
Ranovus®’ ODIN® platform is the world’s first monolithic silicon photonics 100Gbps interconnect platform for multi-terabit optical interconnect applications in data centers.
Innovation
Happens Here.
Our passion is creating disruptive products that address the pressing need for high-capacity optical interconnect in next-generation data centres.
Establishing New Industry Benchmarks
RANOVUS®’ disruptive innovation in Quantum Dot Multi-Wavelength Lasers combined with advanced mixed signal IE and silicon photonics has established new industry benchmarks for cost, power consumption and size.
Disruptive Technology
- Multi-Wavelength Quantum Dot Lasers
- Micro Ring Resonators
- Silicon Photonics and advanced mixed signal IC
- Advanced packaging technologies for high-density integration and volume manufacturing
- High-yield low-cost fiber and laser attach for silicon photonic ICs
Next Generation Cloud
- ODIN® is the world’s first monolithic Electronic & Photonic Integrated Circuit (EPIC) platform for multi-terrabit optical interconnect applications in data centres
- ODIN® delivers massive optical interconnect bandwidth with industry-leading cost, size, and power efficiency.
- ODIN® enables new Co-Packaged Optics (CPO) architectures for unprecedented density, cost, and power efficiency
- Supported by Tier1 ecosystem and supply chain
more
Next Generation Cloud
- Ranovus® uniquely brings together a multi-disciplinary team of industry experts in optoelectronic, lasers, silicon photonics, RF, mixed signal ASIC, advanced packaged and volume manufacturing
- Our passion is creating disruptive products that address the pressing need for high optical interconnect capacity in data centres for AI/ML workloads
more
Disruptive Technology
- Multi-Wavelength Quantum Dot Lasers
- Micro Ring Resonators
- Silicon Photonics and advanced mixed signal IC
- Advanced packaging technologies for high-density integration and volume manufacturing
- High-yield low-cost fiber and laser attach for silicon photonic ICs
Innovative Solutions
- ODIN® is the world’s first monolithic Electronic & Photonic Integrated Circuit (EPIC) platform for multi-terrabit optical interconnect applications in data centres
- ODIN® delivers massive optical interconnect bandwidth with industry-leading cost, size, and power efficiency.
- ODIN® enables new Co-Packaged Optics (CPO) architectures for unprecedented density, cost, and power efficiency
- Supported by Tier1 ecosystem and supply chain
Disruptive Innovators
- Ranovus® uniquely brings together a multi-disciplinary team of industry experts in optoelectronic, lasers, silicon photonics, RF, mixed signal ASIC, advanced packaged and volume manufacturing
- Our passion is creating disruptive products that address the pressing need for high optical interconnect capacity in data centres for AI/ML workloads