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EE Times Europe Magazine – June 2019

The digital version of the latest issue of EE Times Europe Magazine is available now. It features a cover story about the next generation of MEMS microphones, a special report about AI Fairness (how to apply fairness to algorithms and models?), a special feature about Sensor Trends & Technologies and technical articles about Microprocessors and…

Must Reads: Enhanced Cybersecurity for the IIoT

The urgency of IIoT security is becoming ever more apparent, and embedding the highest levels of trust is now essential. The editors at AspenCore have compiled a series that will help you understand how to design in IIoT security, the benefits of hardware-based security, use cases involving the latest security solutions, and more. Read the…

Sensors Hold Key to IoT’s Promise of Smart Everything

The ultimate aim of the internet of things (IoT) is the addition of intelligence to devices and equipment for almost every industry and business sector. Sensors are the vital link in implementing this vision, and smart sensors are being designed into all kinds of gear to address the need for processing and analytics within or…

Isolated Gate Drivers for GaN MOSFETs

An isolation device is an integrated circuit that allows the transfer of data and energy between high- and low-voltage units, preventing the presence of dangerous or uncontrolled transient current coming from the network. The goal is to increase power density and provide insulation strength by improving the efficiency of the power supply and increasing the…

Will Machines Ever Learn to Be Fair?

Will machines ever learn to be fair? Should they? What will it take? Who will decide what that means? And what will the consequences be if they’re not made to be fair? Why are we talking about artificial intelligence (AI) fairness? Because AIs are increasingly making decisions about people: • Will you get hired or…

MEMS in CMOS: An Impossible Dream?

European startup Nanusens, based in London and Barcelona, has an ambitious technology goal: reliable, inexpensive CMOS microelectromechanical-system (MEMS) devices that can be built on the same die as their interface ASIC. The space savings would be game-changing for consumer electronics. Building MEMS in CMOS shouldn’t really be possible. CMOS was not designed for mechanical structures;…

How AI Changes the Future of Edge Computing

As the number of IoT devices — such as mobile phones, virtual assistants, laptops, tablets, building sensors, drones, security cameras, and wearable health sensors — heads toward exceeding 70 billion by 2025, according to Statista, edge-computing applications will also increase. The worldwide number of artificial intelligence (AI) edge devices is forecast to jump from 161.4…

SiC MOSFETs Bring Disruptive Breakthroughs to Power Systems

The power electronics industry took a giant step forward in the early 1980s when the introduction of insulated gate bipolar transistor (IGBT) technology enabled the design of innovative power converters that achieved higher efficiency at lower costs. IGBTs can block high voltages with a low on-resistance (which translates to a low saturation voltage) and can…

What I Learned From Sir Robin Keith Saxby’s Arm Journey

In May, as news came of Sir Robin Keith Saxby’s receiving the 2019 IEEE Founders Medal, I reflected on my own encounters with him since the mid-1980s — from his days at European Silicon Structures (ES2) to his journey at Arm — and what I’ve learned from him along the way. While accolades are quite…

High-Performance Magnetic Sensors Speed EV Charging

Environmental policies are leading us toward zero-emission targets in most major cities of the world by 2050. Achieving zero-emission mobility is critical to reducing the polluting airborne particulate matter present in many urban environments and containing the associated health problems. Toward that end, entrepreneurial and tech strategies have emerged to support a rapid-recharge infrastructure for…

Computex 2019: AMD Details 7-nm Processors, Intel ‘Brings AI to PC’

AMD certainly got an edge over Intel at Computex 2019 in Taipei last month, announcing pricing and availability of the third-generation Ryzen processors based on its 7-nm–based Zen 2 core. Meanwhile, Intel announced that it is shipping its 10-nm Intel Core Ice Lake processor and is bringing artificial intelligence (AI) to the PC. Nvidia also…