1. X
  2. Ayar Labs
Log indTilmeld dig
Ayar Labs
1,118 posts
user avatar
Ayar Labs
@AyarLabs
Ayar Labs is transforming AI infrastructure by accelerating data movement with its cutting-edge CPO solution.
San Jose, CA
ayarlabs.com
Medlem siden May 2015
345
Følger
4.432
Følgere
SvarSvarMedierMedier

Log in or sign up for X

See what’s happening and join the conversation

Continue with phone
or
Log in with username or email
Terms·Privacy·Cookies·Tilgængelighed·Ads Info·© 2026 X Corp.
  • user avatar
    Ayar Labs
    @AyarLabs
    25. jul.
    As silicon photonics moves toward volume production, designing the PIC is only part of the challenge. Designs become more complex once the optical engine is tied to a foundry process, packaging strategy, and system architecture. On @SemiEngineering: bit.ly/4x788BT
    7 t
  • user avatar
    Ayar Labs
    @AyarLabs
    17. jul.
    CPO overcomes the limitations of traditional copper and pluggable optics by enabling thousands of GPUs to operate as a single unified system with the bandwidth and latency needed for hyperscale AI infrastructure. Ayar Labs’ CPO solution: bit.ly/3TbNC4g
    65 t
  • user avatar
    Ayar Labs
    @AyarLabs
    14. jul.
    As AI scale-up accelerates, GPU counts and interconnect bandwidth keep climbing and copper is running out of room. Optical scale-up is now practical, thanks to a semiconductor manufacturing ecosystem that has matured around CPO. More from IEEE Spectrum:
    Nvidia’s NVLink Fusion Quietly Pushes Optics Inside the Rack
    Fra spectrum.ieee.org
    6 t
  • user avatar
    Ayar Labs
    @AyarLabs
    10. jul.
    When key figures all point to the same bottleneck, it's worth paying attention. Ayar Labs joining the NVIDIA NVLink Fusion ecosystem brings CPO to rack-scale AI infrastructure. This enables flexible system architectures and efficient AI scaling beyond the limits of copper.
    1 t
  • user avatar
    Ayar Labs
    @AyarLabs
    18. jun.
    Our SuperNova external light source is built for the realities of hyperscale. It is validated in a liquid-cooled, high-density ELSFP board design, with Wiwynn, that meets the thermal, mechanical, and vibration demands. More on @SemiEngineering: bit.ly/4oCYyDI
    75 t