What is HiDEC?
The High-Density Electronics Center (HiDEC) is a globally competitive core R&D laboratory that provides the tools, education, and expertise to enable ground-breaking electronics research, prototyping, and fabrication to meet academic and industrial needs. HiDEC’s unique electronics processing and packaging capabilities provide critical domestic resources and training for next-generation technology leadership.
HiDEC leads national research in multichip module fabrication, serving UA and various industries. It fosters multidisciplinary and university-industry collaborations by providing essential tools and skills for cutting-edge research and development in electronics across biology, chemistry, physics, and engineering. HiDEC supports UA research groups and prepares students for advanced work in electronics, offering shared equipment that is economically unfeasible for individual labs. HiDEC aims to be a premier regional and national facility for electronics packaging and prototyping R&D.
- This prototype and pilot production lab has developed deliverables for aerial reconnaissance, including 3D-stacked modules with detachable z-axis interposers on a 0.5mm pitch.
- Custom high-voltage electric vehicle drive train power systems, transceivers for the International Space Station, research prototypes for partner industries, and packaging for military and extraterrestrial applications.
- HiDEC’s lab has created unique fixtures and hardware for 10kV and 3D stacked wire bond-less power modules, contributing to better predictive models for electronics durability in extreme environments.
Our Research Labs
Ceramics Processing Lab
- YLTCC Substrate Technology
- HTCC Substrate Technology
Assembly Lab
- Solder attach
- Wire bonding
- Die attachment
- Flip-chip bonding
Analytical Lab
- Die & Bond shear testing
- Accelerated stress testing
- Failure analysis & inspection
What HiDEC Can Help You Accomplish
Thick Film Patterning
- Screen printed conductive inks (LTCC/HTCC)
- Aersol Jet printing (circuit printing on virtually any surface)
- Ceramic GreenTape processing
Thin Film Patterning
- E-beam evaporator
- Spin coating
- Wet bench
- Sputtering
- Lithography (masks, exposure)
Electronics Assembly
- Wire bonding
- SMT/Reflow
- Thermo-compression bonding
- HiPot tester
- Vacuum Brazing
Prototyping/Machining
- CNC milling, micromachining, general metalwork
- CNC punching for mask/stencil fabrication
- Laser cutting/surface etching
- 3D resin printer for high-temperature polymer parts
Environment Stress Testing & Sample Analysis
- Temperature cycling/humidity
- Cross sectioning & sample preparation
- Failure analysis & metallurgical microscopy (reflected light)
- Bond strength testing
Materials Processing
- Vacuum curing
- LN2 dewar fill
- Isostatic lamination
- Ceramics firing
- Resonant acoustic mixing
NOTABLE FACTS
The world's first YBCO superconducting multichip module was fabricated at HiDEC in 1997
A 2009 R&D 100 Award-winning power module was fabricated using HiDEC laboratories
Connect With Us!
HiDEC is here to help propel your ideas toward reality! Reach out to our talented staff for consulation about how we can help you achieve your R&D goals. Email us at powergrp@uark.edu.