Chip Industry Week In Review

By The SE Staff - 31 Jul, 2026 - Comments: 0

DAC: Chips to Systems Conference The energy and buzz at this year's Design Automation Conference surprised everyone — despite initial concerns about its location in Long Beach, California, which is well off the beaten path for semiconductors. Hot topics included AI automation, multiphysics simulation, compute-in-memory, chiplets, physical AI, and the development and orchestration of AI a... » read more

Chip Industry Week In Review

By The SE Staff - 24 Jul, 2026 - Comments: 0

Notable deals Amkor and Nvidia signed a $1.5B multiyear agreement to develop advanced packaging and test technologies for next-gen AI and accelerated-computing platforms. Nvidia’s prepayment will support Amkor’s U.S. capacity expansion in Arizona, including high-density interconnect and heterogeneous integration capabilities. Siemens announced plans to acquire two EDA companies: D... » read more

Chip Industry Week In Review

By The SE Staff - 12 Jun, 2026 - Comments: 0

Notable deals Cadence and Intel Foundry inked a multi-year agreement to advance design technology co-optimization and create PDKs for Intel Foundry's 14A process. Nvidia and SK hynix announced a multi-year partnership to co-develop memory technology for AI infrastructure and physical AI. Teradyne unveiled an integrated test cell solution with TEL that supports known-good device scree... » read more

Chip Industry Week in Review

By The SE Staff - 15 May, 2026 - Comments: 0

Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Chip Industry Week in Review

By The SE Staff - 01 May, 2026 - Comments: 0

Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

Chip Industry Week In Review

By The SE Staff - 27 Feb, 2026 - Comments: 0

Big Deals and Fundings Rapidus secured US$1.7B in a new funding round from the Japanese government and the private sector to ramp 2nm production by next year. Open AI announced a $110B in new funding, with $30B from Nvidia, $30B from Softbank and $50B from Amazon. In a $100B multi-year deal, Meta will power its AI infrastructure with up to 6GW of AMD's GPUs. SambaNova and Intel ar... » read more

Chip Industry Week In Review

By The SE Staff - 13 Feb, 2026 - Comments: 0

Geopolitics U.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential. The U.S.... » read more

Chip Industry Week in Review

By The SE Staff - 06 Feb, 2026 - Comments: 1

Intel hired ex-Qualcomm GPU guru Eric Demers for the company's high-performance GPU push, setting the stage for a three-way battle with Nvidia and AMD. The key targets for Intel and AMD will be better power efficiency and a programming model that rivals CUDA, but don't expect Nvidia to stand still. Acquisitions Texas Instruments plans to acquire Silicon Labs for ~$7.5B cash to enhance i... » read more

Chip Industry Week in Review

By The SE Staff - 09 Jan, 2026 - Comments: 0

SIA's latest monthly global semiconductor sales report reflects a ~30% YOY increase, hitting a record $75.3B in November 2025. Asia Pacific had a notable 66% increase. Cadence launched its Chiplet Spec-to-Packaged Parts ecosystem to accelerate time to market for chiplet development for physical AI, data centers, and HPC applications. Initial IP partners joining Cadence include Arm, Arteris, ... » read more

Chip Industry Week in Review

By The SE Staff - 07 Nov, 2025 - Comments: 0

SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more

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Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week in Review

Chip Industry Week in Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week in Review

Chip Industry Week in Review

Chip Industry Week in Review

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